Power supply voltage at 3.3V

-0.3

4.5

V

Voltage on I/O pads

-0.3

VDD+0.3

V

Differential Input Swing

1.5

Vpp

Storage temperature

Non-condensing

-40

85

Celsius

Powered case temperature range

Non-condensing

-5

70

Celsius

Relative Humidity

5

85

%

Static discharge voltage onhigh speed pins

Human body model

500

V

Static discharge voltage on other pins

Human body model

2000

V

Air discharge to QSFP case

EN61000-4-2 Criterion B Test

15

kV

Contact discharge to QSFP case

EN61000-4-2 Criterion B Test

8

kV

Data rate per lane

8B/10BCoding, 64B/66B Coding

1

10.3125

10.5

Gbps

3.3V Supply Voltage

3.13

3.3

3.47

V

Power supply noise including ripples

1kHz to frequency of operation mersured at VCC_HOST

50

mVpp

Case temperature

0

35

70

Celsius

Power Consumption

-

-

0.8

1

W

Supply Current

-

-

0.24

0.29

mA

Single ended input voltage tolerance

TP1a

-0.3

4

V

Referred to TP1 signal common(Internally AC coupled)

Differential input voltage swing

TP1a

200

1600

mVpp

Peak to peak differential

AC common-mode input voltage tolerance

TP1a

15

-

mV

RMS

Differential input return loss

TP1

See IEEE
802.3ba
86A.4.1.1

-

dB

10MHz to 11.1GHz

Differential to common-mode input return loss

TP1

10

-

dB

10MHz to 11.1GHz

J2 jitter tolerance

TP1a

0.17

-

UI

J9 jitter tolerance

TP1a

0.29

-

UI

Data Dependent Pulse Width Shrinkage (DDPWS) tolerance

TP1a

0.07

-

UI

Eye mask coordinates:
 X1, X2                                                                        Y1, Y2

TP1a

Specification values
0.11, 0.31
95, 350

UI
mV

Hit ratio = 5 x 10-5
see Figure. 3(a)

Single ended input voltage tolerance

TP4

-0.3

-

4

V

Referred to signal common
(Internally AC coupled)

AC common-mode input voltage

TP4

-

-

7.5

mV

RMS

Differential Output swing (p-p)

TP4

-

320
(range 0)

-

mV

See details in the section “Memory
Map”, page03,
 byte 238-239.

-

420
（range 1）

-

mV

Default setting

-

740
（range2）

-

mV

-

-

50

mV

Squelched state

Termination mismatch at 1MHz

TP4

-

-

5

%

Differential output return loss

TP4

See IEEE 802.3ba
 86A.4.2.1

-

dB

10MHz to 11.1GHz

Common-mode output return Loss

TP4

See IEEE 802.3ba
 86A.4.2.2

-

-

dB

10MHz to 11.1GHz

Output transition time,20% to 80%

TP4

28

-

-

ps

J2 jitter output

TP4

-

-

0.42

UI

J9 jitter output

TP4

-

-

0.65

UI

Eye mask coordinates: X1, X2,YI,Y2

TP4

Specification values
0.29, 0.5
150, 425

UI
mV

Hit ratio = 5 x 10-5
see Figure. 3(b)

ResetL,ModSelL

VIL

-0.3

0.8

V

︱Iin︱≤125uA for
0V＜Vin，Vcc

VIH

2

VCC+0.3

V

LPMode

Not connected inside QSFP

ModPraL

Internally terminated to GND

IntL

VOL

0

0.4

V

IOL=2mA

VOH

VCC-0.5

VCC+0.3

V

SCL,SDA

VOL

0

0.4

V

IOL(max)=3mA

VOH

VCC-0.5

VCC+0.3

V

VIL

-0.3

VCC*0.3

V

VIH

VCC*0.7

VCC+0.5

V

Capacitance for SCL and SDA I/O Pin

Ci

14

pF

Total bus capacitice load for SCL and SDA

Cb

100

pF

3.0kohm Pullup resistor,max

200

pF

1.6kohm Pullup resistor,max

Center wavelength

TP2

840

850

860

nm

RMS spectral width

TP2

0.45

nm

Standard deviation

Average launch power

TP2

-2

4

dBm

Each lane

Optical Modulation Amplitude

TP2

-5.6

3

dBm

Each lane

Difference in launch power
between any two lanes(OMA)

TP2

4

dB

Peak power

TP2

0

dBm

Each lane

Launch power in OMA minus TDP

TP2

-6.5

dBm

Each lane

Extinction ratio

TP2

3

dB

Optical return loss tolerance

TP2

12

dB

Encircled flux

TP2

≥86% at 19um,
≤30% at 4.5um

Measured into type Ala.2 50um
fiber in accordance with EN 61280-1-4

Eye mask coordinate:
X1,X2,X3,Y1,Y2,Y3

TP2

Specification values
0.23,0.34,0.43
0.27,0.35,0.40

UI

Hit ratio=5x10-5
see Figure.5

Center wavelength

TP3

840

850

860

nm

Each lane

Damage Threshold

TP3

3.4

dBm

Each lane

Average power at receive input

TP3

-9.5

4

dBm

Each lane

Receiver Reflectance

TP3

-12

dB

Optical Modulation Amplitude

TP3

3

dBm

Each lane

Stressed receiver sensitivity in OMA

TP3

-5.4

dBm

Each lane
Measure with conformance
test signal for BER 10e-12

Condition of Stressed receiver sensitivity

TP3

Vertical Eye Closure Penalty

TP3

1.9

dB

Each lane

Stressed eye J2 Jitter

TP3

0.3

UI

Each lane

Stressed eye J9 Jitter

TP3

0.47

UI

Each lane

OMA of each aggressor lane

TP3

-0.4

dBm

Peak Power

TP3

0

dBm

Each lane

LOS Assert

TP3

-30

dBm

LOS De-assert OMA

TP3

-7.5

dBm

LOS Hysteresis

TP3

0.5

dB

Center wavelength

λ

840

850

860

nm

RMS spectral width

λRMS

4

nm

Average Optical Power

Pavg

-7.3

-1

dBm

Optical Power OMA

Poma

-1.5

dBm

Laser Off Power

Poff

-30

dBm

Extinction Ratio

ER

3.5

dB

Transmitter Dispersion Penalty

TDP

3.9

dB

Relative Intensity Noise

Rin

-128

dB/HZ

Optical Return Loss Tolerance

TP3

20

dB

Center wavelength

λ

840

850

860

nm

Receiver Sensitivity(OMA)

Sen

-11.1

nm

Stressed Sensitivity(OMA)

SenST

-7.5

dBm

Los Assert

LOSA

-30

dBm

Los Dessert

LOSD

-12

dBm

Los Hysteresis

LOSH

0.5

dB

Overload

Sat

0

dB

Receiver Reflectance

Rrx

-12

dB/HZ

1

GND

Signal Ground

Ground

2

CML-I

Tx2n

Tx2n

Transmitter Inverted Date Input.AC coupled

3

CML-I

Tx2p

Tx2p

Transmitter Non_Inverted Date Input.AC coupled

4

GND

Signal Ground

Ground

5

CML-I

Tx4n

Tx4n

Transmitter Inverted Date Input.AC coupled

6

CML-I

Tx4p

Tx4p

Transmitter Non_Inverted Date Input.AC coupled

7

GND

Signal Ground

Ground

8

LVTTL-I

ModSelL

ModSelL

Module Select pin.Selected when held low by the host.

9

LVTTL-I

ResetL

LPMode_Reset

Module Reset.A"low" pulse induces a reset on the module.

10

Vcc Rx

Vcc Rx

+3.3V Power Supply Receiver

11

LVCMOS-I/O

SCL

SCL

2-wire serial interface

12

LVCMOS-I/O

SDA

SDA

13

GND

Signal Ground

Ground

14

CML-O

Rx3p

Rx3p

Receiver Non_Inverted Date Input.AC coupled

15

CML-O

Rx3n

Rx3n

Receiver Inverted Date Input.AC coupled

16

GND

Signal Ground

Ground

17

CML-O

Rx1p

Rx1p

Receiver Non_Inverted Date Input.AC coupled

18

CML-O

Rx1n

Rx1n

Receiver Inverted Date Input.AC coupled

19

GND

Signal Ground

Ground

20

GND

Signal Ground

Ground

21

CML-O

Rx2n

Rx2n

Receiver Inverted Date Input.AC coupled

22

CML-O

Rx2p

Rx2p

Receiver Non_Inverted Date Input.AC coupled

23

GND

Signal Ground

Ground

24

CML-O

Rx4n

Rx4n

Receiver Inverted Date Input.AC coupled

25

CML-O

Rx4p

Rx4p

Receiver Non_Inverted Date Input.AC coupled

26

GND

Signal Ground

Ground

27

LVTTL-O

ModPrsL

ModPrsL

Module Present pin.Internally grounded inside the module.

28

LVTTL-O

IntL

IntL

Interrupt by the QSFP module."Low"indicates an Alarm/Warning.

29

Vcc Tx

Vcc Tx

+3.3V Power Supply Transmitter

30

Vccl

Vccl

+3.3V Power Supply

31

LVTTL-I

LPMode

LPMode

Low Power Mode

32

GND

Signal Ground

Ground

33

CML-I

Tx3p

Tx3p

Transmitter Non_Inverted Date Input.AC coupled

34

CML-I

Tx3n

Tx3n

Transmitter Inverted Date Input.AC coupled

35

GND

Signal Ground

Ground

36

CML-I

Tx1p

Tx1p

Transmitter Non_Inverted Date Input.AC coupled

37

CML-I

Tx1n

Tx1n

Transmitter Inverted Date Input.AC coupled

38

GND

Signal Ground

Ground

1

Transmitter ground (common with receiver ground)

Circuit ground is isolated from chassis ground

2

Transmitter Fault. Not supported

3

Transmitter Disable. Laser output disable on high or open

Disabled: TDIS>2V or open

Enabled: TDIS<0.8V

4

2-wire Serial Interface Data Line

Should Be pulled up with 4.7k – 10k ohm on host board to a voltage between 2V and 3.6V

5

2-wire Serial Interface Clock Line

6

Module Absent. Grounded within the module.

7

No connection required

8

Loss of Signal indication. Logic 0 indicates normal operation

LOS is open collector output

9

No connection required

10

Receiver ground (common with transmitter ground)

Circuit ground is isolated from chassis ground

11

Receiver ground (common with transmitter ground)

12

Receiver Inverted DATA out. AC coupled

13

Receiver Non-inverted DATA out. AC coupled

14

Receiver ground (common with transmitter ground)

Circuit ground is isolated from chassis ground

15

Receiver power supply

16

Transmitter power supply

17

Transmitter ground (common with receiver ground)

Circuit ground is isolated from chassis ground

18

Transmitter Non-Inverted DATA in. AC coupled

19

Transmitter Inverted DATA in. AC coupled

20

Transmitter ground (common with receiver ground)

Circuit ground is isolated from chassis ground

Cable bend radius(Installation)

30

mm

Cable bend radius(Operating)

60

QSFP module insertion

40

N

QSFP module extraction

30

N

Retention Load

100

N

No damage to module below 100N

Insertion/removal cycles

200

Cycles

Number of cycles for an individual module

Cable length(m) C=A+B

A and B lengths may be available upon request