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100Gbps QSFP28 to 4x25Gbps SFP28 Active Optical Breakout Cable

100Gbps QSFP28 to 4x25Gbps SFP28 Active Optical Breakout Cable

Product Descriptions

100Gbps QSFP28 to 4x25Gbps SFP28 Active Optical Breakout Cable

Product Description

ZK-QSFP28-4xSFP28-AOC
100Gbps QSFP28 to 4x25Gbps SFP28 Active Optical Breakout Cable

Features

n Supports 100G to 25G Ethernet interoperability

n Aggregate 4 discrete SFP28 25G channels into single parallel QSFP28 100G interface

n Electrically hot-pluggable

n Electrical interface compliant to QSFP28 connector (SFF-8679&8436)

n Electrical interface compliant to SFP28 connectors (SFF-8431&8432)

n Low profile connectors

n Low power consumption

n Bundle multi-mode fiber array

n 850nm VCSEL four array

n PIN diode four array

n Hot-Pluggable

n I2C management interface

n From 0 to 70 degree case temperature

n 3.3V power supply voltage

n Electrical 38-pin connector

 

Applications

n Network Switch Manufacturers supporting 100/25 G

n Server Manufacturers supporting 100/25 G

n Data Centers with 25G requirements with Aggregation Architectures

 

Standard

n Compliant with IEEE 802.3ba-2010,Annex 86A for 100GBASE-SR4

n Compliant with InfiniBand EDR,FDR,QDR,DDR,SDR

n Compliant with QSFP MSA(SFF-8436)

n Compliant with SFP MSA(SFF-8431)

n RoHS Compliant: lead-free


 

Description 

100Gbps QSFP28 to 4*SFP28 AOC Cable allows bi-directional 100Gbps to 25Gbps transmission suitable for high performance computing (HPC) clustering and other high-throughput data network, with advantages such as high speed, high density, low latency, low power consumption and light weight.

 

Absolute Maximum Ratings

These values represent the damage threshold of the module. Stress in excess of any of the individual Absolute Maximum Ratings can cause immediate catastrophic damage to the module even if all other parameters are within Recommended Operating Conditions.

Parameter

Conditions

Min

Max

Units

Power supply voltage at 3.3V


-0.3

4.5

V

Voltage on I/O pads


-0.3

VDD+0.3

V

Differential Input Swing



1.5

Vpp

Storage temperature

Non-condensing

-40

85

Celsius

Powered case temperature range

Non-condensing

-5

70

Celsius

Relative Humidity


5

85

%

Static discharge voltage on high speed pins

Human body model


500

V

Static discharge voltage on other pins

Human body model


2000

V

Air discharge to QSFP case

EN61000-4-2 Criterion B Test


15

kV

Contact discharge to QSFP case

EN61000-4-2 Criterion B Test


8

kV

 

Recommended Operating Conditions

Parameter

Conditions

Min

Typ.

Max

Units

Data rate per lane

8B/10BCoding, 64B/66B Coding

1

25

28

Gbps

3.3V Supply Voltage


3.13

3.3

3.47

V

Power supply noise including ripples

1kHz to frequency of operation mersured at VCC_HOST



50

mVpp

Case temperature


0

35

70

Celsius

 

Transmitter Specification (Electrical)

Parameter

Condition

Min

Typ.

Max

Units

Power Consumption

-

-

1.0

1.8

W

Supply Current

-

-

0.3

0.6

mA

 

Low Speed Electrical Specification

Parameter

Symbol

Min

Max.

Unit

Notes

ResetL,ModSelL

VIL

-0.3

0.8

V

︱Iin︱≤125uA for
0V＜Vin，Vcc

VIH

2

VCC+0.3

V

LPMode





Not connected inside QSFP

ModPraL





Internally terminated to GND

IntL

VOL

0

0.4

V

IOL=2mA

VOH

VCC-0.5

VCC+0.3

V

SCL,SDA

VOL

0

0.4

V

IOL(max)=3mA

VOH

VCC-0.5

VCC+0.3

V


VIL

-0.3

VCC*0.3

V


VIH

VCC*0.7

VCC+0.5

V

Capacitance for SCL and SDA I/O Pin

Ci


14

pF


Total bus capacitice load for SCL and SDA

Cb


100

pF

3.0kohm Pullup resistor,max



200

pF

1.6kohm Pullup resistor,max

 

QSFP28 Transmitter Optical Specifications

Parameter

Test Point

Min

Typ.

Max

Units

Conditions

Center wavelength

TP2

840

850

860

nm


RMS spectral width

TP2



0.45

nm

Standard deviation

Average launch power

TP2

-2


4

dBm

Each lane

Optical Modulation Amplitude

TP2

-5.6


3

dBm

Each lane

Difference in launch power
between any two lanes(OMA)

TP2



4

dB


Peak power

TP2



0

dBm

Each lane

Launch power in OMA minus TDP

TP2

-6.5



dBm

Each lane

Extinction ratio

TP2

3



dB


Optical return loss tolerance

TP2



12

dB


 

QSFP28 Receiver Optical Specification

Parameter

Test

Point

Min

Typ.

Max

Units

Conditions

Center wavelength

TP3

840

850

860

nm

Each lane

Damage Threshold

TP3

3.4



dBm

Each lane

Average power at receive input

TP3

-9.5


4

dBm

Each lane

Receiver Reflectance

TP3



-12

dB


Optical Modulation Amplitude

TP3



3

dBm

Each lane

Stressed receiver sensitivity in OMA

TP3



-5.4

dBm

Each lane
Measure with conformance
test signal for BER 10e-12

Condition of Stressed receiver sensitivity

TP3






Vertical Eye Closure Penalty

TP3


1.9


dB

Each lane

Stressed eye J2 Jitter

TP3


0.3


UI

Each lane

Stressed eye J9 Jitter

TP3


0.47


UI

Each lane

OMA of each aggressor lane

TP3


-0.4


dBm


Peak Power

TP3



0

dBm

Each lane

LOS Assert

TP3

-30



dBm


LOS De-assert OMA

TP3



-7.5

dBm


LOS Hysteresis

TP3

0.5



dB



SFP28 Transmitter Optical Specification

Parameter

Symbol

Min

Typ.

Max

Units

Note

Center wavelength

λ

840

850

860

nm


RMS spectral width

λRMS



4

nm


Average Optical Power

Pavg

-7.3


-1

dBm

1

Optical Power OMA

Poma


-1.5


dBm


Laser Off Power

Poff



-30

dBm


Extinction Ratio

ER

3.5



dB


Transmitter Dispersion Penalty

TDP



3.9

dB

2

Relative Intensity Noise

Rin



-128

dB/HZ

3

Optical Return Loss Tolerance

TP3

20



dB


 

SFP28 Receiver Optical Specification

Parameter

Symbol

Min

Typ.

Max

Units

Note

Center wavelength

λ

840

850

860

nm


Receiver Sensitivity(OMA)

Sen



-11.1

nm


Stressed Sensitivity(OMA)

SenST



-7.5

dBm


Los Assert

LOSA

-30



dBm


Los Dessert

LOSD



-12

dBm


Los Hysteresis

LOSH

0.5



dB


Overload

Sat

0



dB


Receiver Reflectance

Rrx



-12

dB/HZ


 

QSFP28 Pin Definitions
image.png

 

QSFP28 Pin Definitions

Pin number

Logic

Symbol

Signal

Description

1


GND

Signal Ground

Ground

2

CML-I

Tx2n

Tx2n

Transmitter Inverted Date Input.AC coupled

3

CML-I

Tx2p

Tx2p

Transmitter Non_Inverted Date Input.AC coupled

4


GND

Signal Ground

Ground

5

CML-I

Tx4n

Tx4n

Transmitter Inverted Date Input.AC coupled

6

CML-I

Tx4p

Tx4p

Transmitter Non_Inverted Date Input.AC coupled

7


GND

Signal Ground

Ground

8

LVTTL-I

ModSelL

ModSelL

Module Select pin.Selected when held low by the host.

9

LVTTL-I

ResetL

LPMode_Reset

Module Reset.A"low" pulse induces a reset on the module.

10


Vcc Rx

Vcc Rx

+3.3V Power Supply Receiver

11

LVCMOS-I/O

SCL

SCL

2-wire serial interface

12

LVCMOS-I/O

SDA

SDA

13


GND

Signal Ground

Ground

14

CML-O

Rx3p

Rx3p

Receiver Non_Inverted Date Input.AC coupled

15

CML-O

Rx3n

Rx3n

Receiver Inverted Date Input.AC coupled

16


GND

Signal Ground

Ground

17

CML-O

Rx1p

Rx1p

Receiver Non_Inverted Date Input.AC coupled

18

CML-O

Rx1n

Rx1n

Receiver Inverted Date Input.AC coupled

19


GND

Signal Ground

Ground

20


GND

Signal Ground

Ground

21

CML-O

Rx2n

Rx2n

Receiver Inverted Date Input.AC coupled

22

CML-O

Rx2p

Rx2p

Receiver Non_Inverted Date Input.AC coupled

23


GND

Signal Ground

Ground

24

CML-O

Rx4n

Rx4n

Receiver Inverted Date Input.AC coupled

25

CML-O

Rx4p

Rx4p

Receiver Non_Inverted Date Input.AC coupled

26


GND

Signal Ground

Ground

27

LVTTL-O

ModPrsL

ModPrsL

Module Present pin.Internally grounded inside the module.

28

LVTTL-O

IntL

IntL

Interrupt by the QSFP module."Low"indicates an Alarm/Warning.

29


Vcc Tx

Vcc Tx

+3.3V Power Supply Transmitter

30


Vccl

Vccl

+3.3V Power Supply

31

LVTTL-I

LPMode

LPMode

Low Power Mode

32


GND

Signal Ground

Ground

33

CML-I

Tx3p

Tx3p

Transmitter Non_Inverted Date Input.AC coupled

34

CML-I

Tx3n

Tx3n

Transmitter Inverted Date Input.AC coupled

35


GND

Signal Ground

Ground

36

CML-I

Tx1p

Tx1p

Transmitter Non_Inverted Date Input.AC coupled

37

CML-I

Tx1n

Tx1n

Transmitter Inverted Date Input.AC coupled

38


GND

Signal Ground

Ground

Housing



Chassis Ground


 

SFP28 Pin Definitions
image.png
image.png

 

SFP28 Pin Definitions

PIN

Description

Remarks

1

Transmitter ground (common with receiver ground)

Circuit ground is isolated from chassis ground

2

Transmitter Fault. Not supported


3

Transmitter Disable. Laser output disable on high or open

Disabled: TDIS>2V or open

Enabled: TDIS<0.8V

4

2-wire Serial Interface Data Line

Should Be pulled up with 4.7k – 10k ohm on host board to a voltage between 2V and 3.6V

5

2-wire Serial Interface Clock Line

6

Module Absent. Grounded within the module.

7

No connection required


8

Loss of Signal indication. Logic 0 indicates normal operation

LOS is open collector output

9

No connection required


10

Receiver ground (common with transmitter ground)

Circuit ground is isolated from chassis ground

11

Receiver ground (common with transmitter ground)

12

Receiver Inverted DATA out. AC coupled


13

Receiver Non-inverted DATA out. AC coupled


14

Receiver ground (common with transmitter ground)

Circuit ground is isolated from chassis ground

15

Receiver power supply


16

Transmitter power supply


17

Transmitter ground (common with receiver ground)

Circuit ground is isolated from chassis ground

18

Transmitter Non-Inverted DATA in. AC coupled


19

Transmitter Inverted DATA in. AC coupled


20

Transmitter ground (common with receiver ground)

Circuit ground is isolated from chassis ground

 

Mechanical Specifications

Parameter

Min

Max.

Unit

Notes

Cable bend radius(Installation)

30


mm


Cable bend radius(Operating)

60




QSFP module insertion


40

N


QSFP module extraction


30

N


Retention Load

100


N

No damage to module below 100N

Insertion/removal cycles

200


Cycles

Number of cycles for an individual module

 

Functional Block Diagram of the QSFP Module
image.png

Mechanical Dimensions
image.png

 

Cable length(m) C

A length

B length

Cable length(m) C=A+B

A and B lengths may be available upon request


Important Notice

Performance figures, data and any illustrative material  provided  in this  data sheet  are typical  and  must  be specifically confirmed in writing by Zkosemi before they become applicable to any particular order or contract. In accordance with the Zkosemi policy of continuous improvement specifications may change without notice. The publication of information in this data sheet does not imply freedom from patent or other protective rights of Zkosemi or others. Further details are available from any Zkosemi sales representative.